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BA3662CP-V5 Scheda tecnica(PDF) 9 Page - Rohm |
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BA3662CP-V5 Scheda tecnica(HTML) 9 Page - Rohm |
9 / 12 page Technical Note 9/11 BA3662CP-V5 www.rohm.com 2010.10 - Rev.A © 2010 ROHM Co., Ltd. All rights reserved. 30 0 0.1 1 10 10 0 0 20 0 10 0 U nstable operating region Stable operating region U nstable operating region Io[mA] Fig.16 Cout_ESR vs Io (reference data) ※ Operation Note 10 Measurement circuit Cout(22µF) Vcc Vo CTL GND ADJ R1 R2 Cin VCTL (5V) (0.33µF) ESR Io (ROUT) (0.001Ω~) (2k~15kΩ) Vcc (10V) Vcc=10V Vo=5V Ta=25℃ R1=2kΩ~15kΩ Cin=0.33µF Cout=22µF 10. Vo Terminal Please attach an anti-oscillation capacitor between Vo and GND. The capacitance of the capacitor may significantly change due to factors such as temperature changes, which may cause oscillations. Please use a tantalum capacitor or aluminum electrolytic capacitor with favorable characteristics and small external series resistance (ESR) even at low temperatures. The output oscillates regardless of whether the ESR is large or small. Please use the IC within the stable operating region while referring to the ESR characteristics reference data shown in Fig.16. In cases where there are sudden load fluctuations, the large capacitor is recommended. Below figure, it is ESR-to-Io stability Area characteristics, measured by 22µF-ceramic-capacitor and resistor connected in series. This characteristic is not equal value perfectly to 22µF-aluminum electrolytic capacitor in order to measurement method. Note, however, that the stable range suggested in the figure depends on the IC and the resistance load involved, and can vary with the board’s wiring impedance, input impedance, and/or load impedance. Therefore, be certain to ascertain the final status of these items for actual use. Keep capacitor capacitance within a range of 22µF~1000µF. It is also recommended that a 0.33µF bypass capacitor be connected as close to the input pin-GND as location possible. However, in situations such as rapid fluctuation of the input voltage or the load, please check the operation in real application to determine proper capacitance. 11. Over current protection circuit (OCP) The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous or transitive operation of the protection circuits. 12. Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after this function has activated, or in applications where the operation of this circuit is assumed. 13. Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent reverse current flow, or insert bypass diodes between Vcc and each pin. |
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