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AD7280ABSTZ-RL Scheda tecnica(PDF) 7 Page - Analog Devices

Il numero della parte AD7280ABSTZ-RL
Spiegazioni elettronici  Lithium Ion Battery Monitoring System Cell balancing interface
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Produttore elettronici  AD [Analog Devices]
Homepage  http://www.analog.com
Logo AD - Analog Devices

AD7280ABSTZ-RL Scheda tecnica(HTML) 7 Page - Analog Devices

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AD7280A
Rev. 0 | Page 7 of 48
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
VDD to VSS, AGND
−0.3 V to +33 V
VSS to AGND, DGND
−0.3 V to +0.3 V
VIN0 to VIN5 Voltage to VSS, AGND
VSS − 0.3 V to VDD + 0.3 V
VIN6 Voltage to VSS, AGND
VDD − 0.3 V to VDD + 1 V
CB1 Output to VSS, AGND
−0.3 V to DVCC + 0.3 V
CBx Output to VIN(x − 1)1
−0.3 V to VIN(x − 1)1 + 7 V
AUX1 to AUX6 Voltage to VSS, AGND
−0.3 V to AVCC + 0.3 V
AUXTERM Voltage to VSS, AGND
−0.3 V to AVCC + 0.3 V
AVCC to VSS, AGND, DGND
−0.3 V to +7 V
DVCC to AVCC
−0.3 V to +0.3 V
DVCC to VSS, DGND
−0.3 V to +7 V
VDRIVE to VSS, AGND
−0.3 V to +7 V
AGND to DGND
−0.3 V to +0.3 V
Digital Input Voltage to VSS, DGND
−0.3 V to VDRIVE + 0.3 V
Digital Output Voltage to VSS, DGND
−0.3 V to VDRIVE + 0.3 V
Input Current to Any Pin Except
Supply Pins2
±10 mA
Operating Temperature Range
−40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
Pb-Free Temperature,
Soldering Reflow
260(+0)°C
ESD
2 kV
1 x = 2 to 6.
2 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
To conform with IPC 2221 industrial standards, it is advisable
to use conformal coating on the high voltage pins.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
48-Lead LQFP (ST-48)
76.2
17
°C/W
ESD CAUTION


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