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FAN2564 Scheda tecnica(PDF) 11 Page - Fairchild Semiconductor

Il numero della parte FAN2564
Spiegazioni elettronici  300mA Low VIN LDO for Digital Applications
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Produttore elettronici  FAIRCHILD [Fairchild Semiconductor]
Homepage  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN2564 Scheda tecnica(HTML) 11 Page - Fairchild Semiconductor

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© 2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN2564 • Rev. 1.0.2
11
Physical Dimensions
BOTTOM VIEW
SIDE VIEWS
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: MKT-UC004ABrev2.
2X
PIN A1 AREA
0.03 C
E
D
A
B
2X
0.03 C
0.05 C
0.625
0.539
C
0.332±0.018
0.250±0.025
SEATING PLANE
D
F
F
0.06 C
1 2
A
B
0.005
CA B
0.50
0.50
Ø0.315±0.025
4X
(Y)±0.018
(X)±0.018
(Ø0.250)
Cu Pad
(Ø0.350)
Solder Mask
0.50
0.50
Figure 26.
4-Bump, Wafer-Level Chip-Scale Package (WLCSP), 0.5mm Pitch
Product Specific Dimensions
Product
D
E
X
Y
FAN2564UCX
1.41 +/-0.030
0.93 +/-0.030
0.215
0.455
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, spe-
cifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.


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