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FAN2560 Scheda tecnica(PDF) 10 Page - Fairchild Semiconductor

Il numero della parte FAN2560
Spiegazioni elettronici  350mA Low-VIN LDO with Fast Transient Response
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Produttore elettronici  FAIRCHILD [Fairchild Semiconductor]
Homepage  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN2560 Scheda tecnica(HTML) 10 Page - Fairchild Semiconductor

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© 2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN2560 • Rev. 1.0.1
10
Physical Dimensions
A1
E
0.625 MAX
SEATING PLANE
0.06 C
5 X Ø0.315 +/- .025
TOP VIEW
BOTTOM VIEW
(Ø0.35)
SOLDER MASK
OPENING
(Ø0.25)
Cu PAD
RECOMMENDED LAND PATTERN (NSMD)
BALL A1
INDEX AREA
0.03 C
0.05 C
D
2X
(Y)+/-.018
(X)+/-.018
B
A
D
0.250±0.025
C
1 2
A
B
C
0.03 C
2X
E
0.005
CA B
0.50
0.433
0.50
(0.50)
(0.433)
(0.866)
3
0.332±0.018
SIDE VIEWS
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
A. NO JEDEC REGISTRATION APPLIES
ASME Y14.5M, 1994
D
DATUM C, THE SEATING PLANE, IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
E
PACKAGE TYPICAL HEIGHT IS 582 MICRONS
+/- 43 MICRONS (539-625 MICRONS)
FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. BALL COMPOSITION: Sn95.5Ag3.9Cu0.6
SAC405 ALLOY
H. DRAWING FILENAME: MKT-UC005AArev5
F
F
F
F
F
Figure 26. Wafer-Level Chip-Scale Packaging (WLCSP)
Product Specific Dimensions
Product
D
E
X
Y
FAN2560UC13X
1.330 +/- 0.030
0.960 +/- 0.030
0.230
0.232
FAN2560UC15X
1.330 +/- 0.030
0.960 +/- 0.030
0.230
0.232
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.


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