LC86P7248

No.6838-9/20

1. Absolute Maximum Ratings at Ta=25

°C, VSS=VSS1=VSS2=VSS3=0V

Ratings

Parameter

Symbol

Pins

Conditions

min.

typ.

max.

unit

Supply voltage

VDDMAX

VDD1, VDD2

VDD3

VDD1=VDD2=

VDD3

-0.3

+7.0

LCD display

voltage

VLCD

V1/PL6, V2/PL5

V3/PL4

VDD1=VDD2=

VDD3

-0.3

VDD

Input voltage

VI

•Ports 71, 72, 73

•Ports 74 , 75

•Port 8, Port L

• RES

-0.3

VDD+0.3

Input/output

voltage

VIO

•Port 0, 1, 3

•Port 70

•Ports A,B,C,D,E,F

-0.3

VDD+0.3

V

IOPH(1)

Ports 0, 1, 3

-4

Peak

output

current

IOPH(2)

Ports A,B,C,D,E,F

•CMOS output

•At each pins

-4

ΣIOAH(1) Ports 0, 1, 32, 33,

34, 35

Total all pins

-38

ΣIOAH(2) Ports 30, 31

Total all pins

-4

ΣIOAH(3) Ports S0 to S25

Total all pins

-25

High

level

output

current

Total

output

current

vIOAH(4)

Ports S26 to S47

Total all pins

-25

IOPL(1)

Ports 0, 1, 3

At each pins

20

IOPL(2)

Ports A,B,C,D,E,F

At each pins

20

Peak

output

current

IOPL(3)

Port 70

At each pins

15

ΣIOAL(1)

Ports 0, 1, 32, 33,

34, 35

Total all pins

50

ΣIOAL(2)

Ports 30, 31

Total all pins

20

ΣIOAL(3)

Ports S0 to S25

Total all pins

39

ΣIOAL(4)

Ports S26 to S47

Total all pins

33

Low

level

output

current

Total

output

current

ΣIOAL(5)

Port 70

Total all pins

10

mA

Maximum

power

dissipation

Pdmax

QIP100E

Ta=-30 to +70

°C

515

mW

Operating

temperature

range

Topr

-30

+70

Storage

temperature

range

Tstg

-55

+125

°C

Notes

• The QIP packages should be heat-soaked for 12 hours at 125

°C immediately prior to mounting (This baking is called

pre-baking).

• After pre-baking, a controlled environment must be maintained until soldering.

The environment must be held at a

temperature of 30

°C or less and a humidity level of 70% or less. Please solder within 24 hours.