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FAN5702UC20X Scheda tecnica(PDF) 5 Page - Fairchild Semiconductor |
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FAN5702UC20X Scheda tecnica(HTML) 5 Page - Fairchild Semiconductor |
5 / 17 page © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5702 • Rev. 1.0.3 5 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Units VCC VIN, VOUT Pins –0.3 6.0 V Other Pins (1) –0.3 VIN + 0.3 V ESD Electrostatic Discharge Protection Level Human Body Model per JESD22-A114 3 kV Charged Device Model per JESD22-C101 2 TJ Junction Temperature –40 +150 °C TSTG Storage Temperature –65 +150 °C TL Lead Soldering Temperature, 10 Seconds +260 °C Note: 1. Lesser of VIN + 0.3 or 6.0V. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol Parameter Min. Max. Units VIN Supply Voltage 2.7 5.5 V VLED LED Forward Voltage 2 4 V TA Ambient Temperature –40 +85 °C TJ Junction Temperature –40 +125 °C Thermal Properties Symbol Parameter Min. Typ. Max. Units ΘJA Junction-to-Ambient Thermal Resistance WLCSP 80 °C/W UMLP 49 Note: 2. Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p boards in accordance to JESD51-7 JEDEC standard. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperate TA. |
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