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STPS10L60CFP Scheda tecnica(PDF) 6 Page - STMicroelectronics |
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STPS10L60CFP Scheda tecnica(HTML) 6 Page - STMicroelectronics |
6 / 8 page Package information STPS10L60C 6/8 Figure 12. Footprint (dimensions in millimeters) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 4. D2PAK dimensions Ref Dimensions Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R 0.40 typ. 0.016 typ. V2 0° 8° 0° 8° G L L3 L2 B B2 E * FLAT ZONE NO LESS THAN 2mm A C2 D R A2 M V2 C A1 * 16.90 10.30 8.90 3.70 5.08 1.30 |
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