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TS5V330RGYRG4 Scheda tecnica(PDF) 4 Page - Texas Instruments

Il numero della parte TS5V330RGYRG4
Spiegazioni elettronici  QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
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TS5V330RGYRG4 Scheda tecnica(HTML) 4 Page - Texas Instruments

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background image
DA
S1A
S2A
S1B
S2B
S1C
S2C
S1D
S2D
EN
IN
DC
DB
DD
4
7
9
12
2
3
5
6
11
10
14
13
15
1
Control
Logic
Absolute Maximum Ratings
(1)
TS5V330
SCDS164D – MAY 2004 – REVISED JUNE 2009 .............................................................................................................................................................. www.ti.com
FUNCTIONAL DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
7
V
VIN
Control input voltage range(2)(3)
–0.5
7
V
VI/O
Switch I/O voltage range(2)(3)(4)
–0.5
7
V
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
II/O
ON-state switch current(5)
±128
mA
Continuous current through VCC or GND
±100
mA
D package(6)
73
DBQ package(6)
90
θ
JA
Package thermal impedance
°C/W
PW package(6)
108
RGY package(7)
39
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to ground, unless otherwise specified.
(3)
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4)
VI and VO are used to denote specific conditions for VI/O.
(5)
II and IO are used to denote specific conditions for II/O.
(6)
The package thermal impedance is calculated in accordance with JESD 51-7.
(7)
The package thermal impedance is calculated in accordance with JESD 51-5.
4
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Copyright © 2004–2009, Texas Instruments Incorporated
Product Folder Link(s): TS5V330


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