1

FEATURES

3

2

4

6

1

1A

1Y

2Y

GND

2A

3

2

4

6

1

1A

1Y

2Y

GND

2A

1A

2A

1Y

2Y

GND

Seemechanicaldrawingsfordimensions.

1

4

2

3

6

V

CC

V

CC

5

V

CC

5

5

DBVPACKAGE

(TOP VIEW)

DCKPACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOMVIEW)

DESCRIPTION/ORDERING INFORMATION

SN74AUC2G07

DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

2

• Available in the Texas Instruments NanoFree™

• Low Power Consumption, 10 µA at 1.8 V

Package

• ±8-mA Output Drive at 1.8 V

• Optimized for 1.8-V Operation and Is 3.6-V I/O

• Latch-Up Performance Exceeds 100 mA Per

Tolerant to Support Mixed-Mode Signal

JESD 78, Class II

Operation

• ESD Protection Exceeds JESD 22

• I

–

2000-V Human-Body Model (A114-A)

Operation

–

200-V Machine Model (A115-A)

• Sub-1-V Operable

–

1000-V Charged-Device Model (C101)

• Max t

operation.

The output of the SN74AUC2G07 is open drain and can be connected to other open-drain outputs to implement

active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74AUC2G07YZPR

_ _ _UV_

0.23-mm Large Bump – YZP (Pb-free)

Reel of 3000

SN74AUC2G07DBVR

–40C to 85C

SOT (SOT-23) – DBV

U07_

Reel of 250

SN74AUC2G07DBVT

SOT (SC-70) – DCK

Reel of 3000

SN74AUC2G07DCKR

UV_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2008, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.