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SN74AUC2G06DBVR Scheda tecnica(PDF) 1 Page - Texas Instruments |
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SN74AUC2G06DBVR Scheda tecnica(HTML) 1 Page - Texas Instruments |
1 / 13 page www.ti.com FEATURES Seemechanicaldrawingsfordimensions. DBVPACKAGE (TOP VIEW) DCKPACKAGE (TOP VIEW) YZP PACKAGE (BOTTOMVIEW) 2 GND V CC 5 3 4 2A 2Y 6 1 1A 1Y 3 4 2A 2 GND 2Y 5 1 1A V CC 6 1Y 2 GND V CC 1 5 1A 2A 4 3 2Y 6 1Y DESCRIPTION/ORDERING INFORMATION SN74AUC2G06 DUAL INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES442C – MAY 2003 – REVISED JANUARY 2007 • Available in the Texas Instruments • Low Power Consumption, 10 µA at 1.8 V NanoFree™ Package • ±8-mA Output Drive at 1.8 V • Optimized for 1.8-V Operation and Is 3.6-V I/O • Latch-Up Performance Exceeds 100 mA Per Tolerant to Support Mixed-Mode Signal JESD 78, Class II Operation • ESD Protection Exceeds JESD 22 • I off Supports Partial-Power-Down Mode – 2000-V Human-Body Model (A114-A) Operation – 200-V Machine Model (A115-A) • Sub-1-V Operable – 1000-V Charged-Device Model (C101) • Max t pd of 2.5 ns at 1.8 V This dual inverter buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The output of the SN74AUC2G06 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74AUC2G06YZPR _ _ _UT_ 0.23-mm Large Bump – YZP (Pb-free) –40 °C to 85°C SOT (SOT-23) – DBV Reel of 3000 SN74AUC2G06DBVR U06_ SOT (SC-70) – DCK Reel of 3000 SN74AUC2G06DCKR UT_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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