CLK_SEL

VBB

30

31

29

28

27

26

23

22

24

21

20

19

18

17

15

14

13

12

11

10

5

CLK0

CLK0

CLK1

CLK1

0

1

3

4

6

7

2

Q0

Q1

Q2

Q3

Q4

Q5

Q6

Q7

Q8

Q9

Q0

Q1

Q2

Q3

Q4

Q5

Q7

Q6

Q9

Q8

+

+

-

-

-

-

-

CDCLVP111

SCAS859D – JANUARY 2009 – REVISED MARCH 2010

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

DEVICE INFORMATION

PIN

DESCRIPTION

NAME

NO.

Clock select. Used to select between CLK0 and CLK1 input pairs. LVTTL/LVCMOS functionality

CLK_SEL

2

compatible.

CLK0, CLK0

3, 4

Differential LVECL/LVPECL input pair

CLK1, CLK1

6, 7

11, 13, 15, 18,

Q [9:0]

20, 22, 24, 27,

LVECL/LVPECL clock outputs, these outputs provide low-skew copies of CLKn.

29, 31

10, 12, 14, 17,

Q[9:0]

19, 21,23, 26,

LVECL/LVPECL complementary clock outputs, these outputs provide copies of CLKn.

28, 30

5

Reference voltage output for single-ended input operation

1, 9, 16, 25, 32

Supply voltage

8

Device ground or negative supply voltage in ECL mode

The PowerPAD of the QFN32 and LQFP package is thermally connected to the die to improve the heat

PowerPAD™

0

transfer out of the package. The pad of the LQFP with PowerPAD must be left floating or connected to

(1)

CLKn, CLK_SEL pull down resistor = 75 k

Ω; CLKn pull up resistor = 37.5 kΩ; CLKn pull down resistor = 50 kΩ.

2

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