ADM1024

http://onsemi.com

2

Figure 1. Functional Block Diagram

10−BIT ADC

D1+

D1–

GND

ADM1024

CI

VID0/IRQ0

VID1/IRQ1

VID2/IRQ2

VID3/IRQ3

VID4/IRQ4

FAN1/AIN1

FAN2/AIN2

POWER TO CHIP

PULLUPS

VID0–3 AND

FAN DIVISOR

REGISTER

VID4 AND

DEVICE ID

REGISTER

FAN SPEED

COUNTER

INPUT

ATTENUATORS

AND

ANALOG

MULTIPLEXER

BAND GAP

TEMPERATURE

SENSOR

ADDRESS

POINTER

REGISTER

TEMPERATURE

CONFIGURATION

REGISTER

2.5V

BAND GAP

REFERENCE

SERIAL BUS

INTERFACE

CHANNEL

MODE

REGISTER

VALUE AND

LIMIT

REGISTERS

LIMIT

COMPARATORS

INTERRUPT

STATUS

REGISTERS

INT MASK

REGISTERS

INTERRUPT

MASKING

CONFIGURATION

REGISTERS

ANALOG

OUTPUT

REGISTER AND

8−BIT DAC

NTEST_OUT/ADD

INT

NTEST_IN/AOUT

THERM

RESET

100k

CHASSIS

INTRUSION

CLEAR

REGISTER

SDA

SCL

W

100k W

100k W

100k W

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

6.5

V

20

V

V

Voltage on Any Other Input or Output Pin

−0.3 to +6.5

V

Input Current at Any Pin

±5

mA

Package Input Current

±20

mA

150

°C

Storage Temperature Range

−65 to +150

°C

Lead Temperature, Soldering

Vapor Phase (60 sec)

Infrared (15 sec)

215

200

°C

ESD Rating All Pins

2000

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

Package Type

Unit

24−Lead Small Outline Package

50

10

°C/W