BTA201W_SER_3

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 — 13 March 2008

5 of 13

NXP Semiconductors

BTA201W series E

1 A Three-quadrant triacs high commutation

5.

Thermal characteristics

[1]

Mounted on a printed-circuit board.

Table 4.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to solder point

see Figure 6

--15

K/W

thermal resistance from

junction to ambient

minimum footprint; see Figure 14

[1] -

156

-

K/W

for pad area; see Figure 15

[1] -

70

-

K/W

(1) Unidirectional

(2) Bidirectional

Fig 6.

Transient thermal impedance from junction to solder point as a function of pulse width

001aag969

1

10

(K/W)

110

(2)

(1)

P

t