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TS5A3359DCUT Scheda tecnica(PDF) 1 Page - Texas Instruments |
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TS5A3359DCUT Scheda tecnica(HTML) 1 Page - Texas Instruments |
1 / 26 page 1 FEATURES APPLICATIONS DESCRIPTION/ORDERING INFORMATION TS5A3359 1- Ω SP3T ANALOG SWITCH 5-V/3.3-V SINGLE-CHANNEL 3:1 MULTIPLEXER/DEMULTIPLEXER SCDS214C – OCTOBER 2005 – REVISED JANUARY 2008 www.ti.com • Cell Phones 2 • Isolation in Power-Down Mode, V + = 0 • PDAs • Specified Break-Before-Make Switching • Portable Instrumentation • Low ON-State Resistance (1 Ω) • Audio and Video Signal Routing • Control Inputs Are 5.5-V Tolerant • Low-Voltage Data Acquisition Systems • Low Charge Injection • Communication Circuits • Excellent ON-State Resistance Matching • Modems • Low Total Harmonic Distortion (THD) • Hard Drives • 1.65-V to 5.5-V Single-Supply Operation • Computer Peripherals • Latch-Up Performance Exceeds 100 mA Per • Wireless Terminals and Peripherals JESD 78, Class II • ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) FUNCTION TABLE COM TO NO, IN2 IN1 NO TO COM L L OFF L H COM = NO0 H L COM = NO1 H H COM = NO2 The TS5A3359 is a single-pole triple-throw (SP3T) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature, to prevent signal distortion during the transferring of a signal from one channel to another. The device has an excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications. ORDERING INFORMATION TA PACKAGE(1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP Tape and reel TS5A3359YZPR _ _ _J9_ –40 °C to 85°C (Pb-free) VSSOP – DCU Tape and reel TS5A3359DCUR JAL_ (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2005–2008, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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