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TPIC9201N Scheda tecnica(PDF) 11 Page - Texas Instruments |
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TPIC9201N Scheda tecnica(HTML) 11 Page - Texas Instruments |
11 / 20 page www.ti.com PCB Layout Application Using a Multilayer PCB PackageThermalPad SolderPad(LandPattern) ThermalVias PackageOutline PowerPad PackageSolderPad PackageSolderPad (BottomTrace) ThermalVia ComponentTraces ThermalIsolation PowerPlaneOnly 1.5748mm 0.0 0.071-mmBoardBase – andBottomPad 0.5246 0.5606-mm – PowerPlane (1-ozCu) 1.0142 1.0502-mm – GroundPlane (1-ozCu) 1.5038 1.5748-mm – ComponentTrace (2-ozCu) 2Plane 4Plane Application Using a Single-Layer PCB TPIC9201 MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER SLIS115D – APRIL 2005 – REVISED FEBRUARY 2008 To maximize the efficiency of this package for application on a single-layer or multilayer PCB, certain guidelines must be followed when laying out this part on the PCB. The following information is to be used as a guideline only. For further information, see the PowerPAD concept implementation document. In a multilayer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane (see Figure 4 and Figure 5). The efficiency of this method depends on several factors: die area, number of thermal vias, thickness of copper, etc. (see the PowerPAD™ Thermally Enhanced Package Technical Brief, literature number SLMA002). Figure 4. Package and PCB Land Configuration for a Multilayer PCB Figure 5. Multilayer Board (Side View) In a single-layer board application, the thermal pad is attached to a heat spreader (copper area) by using the low thermal-impedance attachment method (solder paste or thermal-conductive epoxy). With either method, it is advisable to use as much copper trace area as possible to dissipate the heat. Copyright © 2005–2008, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s): TPIC9201 |
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