BCX52 datasheet(4/12 Pages) NXP

Il numero della parte	BCX52

Spiegazioni elettronici	60 V, 1 A PNP medium power transistors

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Produttore elettronici	NXP [NXP Semiconductors]

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BCP52_BCX52_8

Product data sheet

Rev. 08 — 25 February 2008

4 of 12

NXP Semiconductors

BCP52; BCX52

60 V, 1 A PNP medium power transistors

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.

[3]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.

(1) FR4 PCB, mounting pad for collector 1 cm2

(2) FR4 PCB, standard footprint

(1) FR4 PCB, mounting pad for collector 6 cm2

(2) FR4 PCB, mounting pad for collector 1 cm2

(3) FR4 PCB, standard footprint

Fig 1.

Power derating curves SOT223

Fig 2.

Power derating curves SOT89

006aaa220

Tamb (°C)

−75

175

125

25

75

−25

0.8

0.4

1.2

1.6

Ptot

(W)

0

(2)

(1)

Tamb (°C)

−75

175

125

25

075

−25

006aaa221

0.8

0.4

1.2

1.6

Ptot

(W)

0

(1)

(2)

(3)

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Rth(j-a)

thermal resistance from

junction to ambient

in free air

BCP52

[1] -

-

190

K/W

[2] -

-

125

K/W

BCX52

[1] -

-

230

K/W

[2] -

-

135

K/W

[3] --95

K/W

Rth(j-sp)

thermal resistance from

junction to solder point

BCP52

-

17

K/W

BCX52

-

20

K/W

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