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TMP320C6720ZDH250 Scheda tecnica(PDF) 1 Page - Texas Instruments

Il numero della parte TMP320C6720ZDH250
Spiegazioni elettronici  Floating-Point Digital Signal Processors
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
Logo TI - Texas Instruments

TMP320C6720ZDH250 Scheda tecnica(HTML) 1 Page - Texas Instruments

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TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720 DSPs
1.1 Features
TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720
Floating-Point Digital Signal Processors
www.ti.com
SPRS370E – SEPTEMBER 2006 – REVISED JULY 2008
• C672x: 32-/64-Bit 350-MHz Floating-Point DSPs
• Three Multichannel Audio Serial Ports
Transmit/Receive Clocks up to 50 MHz
• Upgrades to C67x+ CPU From C67x™ DSP
Six Clock Zones and 16 Serial Data Pins
Generation:
Supports TDM, I2S, and Similar Formats
2X CPU Registers [64 General-Purpose]
DIT-Capable (McASP2)
New Audio-Specific Instructions
Compatible With the C67x CPU
• Universal Host-Port Interface (UHPI)
32-Bit-Wide Data Bus for High Bandwidth
• Enhanced Memory System
Muxed and Non-Muxed Address and Data
256K-Byte Unified Program/Data RAM
384K-Byte Unified Program/Data ROM
• Two 10-MHz SPI Ports With 3-, 4-, and 5-Pin
Single-Cycle Data Access From CPU
Options
Large Program Cache (32K Byte) Supports
• Two Inter-Integrated Circuit (I2C) Ports
RAM, ROM, and External Memory
• Real-Time Interrupt Counter/Watchdog
• External Memory Interface (EMIF) Supports
• Oscillator- and Software-Controlled PLL
133-MHz SDRAM (16- or 32-Bit)
• Applications:
Asynchronous NOR Flash, SRAM (8-,16-, or
Professional Audio
32-Bit)
• Mixers
NAND Flash (8- or 16-Bit)
• Effects Boxes
• Enhanced I/O System
• Audio Synthesis
High-Performance Crossbar Switch
• Instrument/Amp Modeling
Dedicated McASP DMA Bus
• Audio Conferencing
Deterministic I/O Performance
• Audio Broadcast
• dMAX (Dual Data Movement Accelerator)
• Audio Encoder
Supports:
Emerging Audio Applications
16 Independent Channels
Biometrics
Concurrent Processing of Two Transfer
Medical
Requests
Industrial
1-, 2-, and 3-Dimensional
• Commercial or Extended Temperature
Memory-to-Memory and
Memory-to-Peripheral Data Transfers
• 144-Pin, 0.5-mm, PowerPAD™ Thin Quad
Circular Addressing Where the Size of a
Flatpack (TQFP) [RFP Suffix]
Circular Buffer (FIFO) is not Limited to 2n
• 256-Terminal, 1.0-mm, 16x16 Array Plastic Ball
Table-Based Multi-Tap Delay Read and
Grid Array (PBGA) [GDH and ZDH Suffixes]
Write Transfers From/To a Circular Buffer
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this document.
C67x, PowerPAD, TMS320C6000, C6000, DSP/BIOS, XDS, TMS320 are trademarks of Texas Instruments.
Philips is a registered trademark of Koninklijki Philips Electronics N.V.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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