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74LVC3G07DP Scheda tecnica(PDF) 10 Page - NXP Semiconductors |
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74LVC3G07DP Scheda tecnica(HTML) 10 Page - NXP Semiconductors |
10 / 16 page 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 10 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output Fig 11. Package outline SOT765-1 (VSSOP8) UNIT A1 A max. A2 A3 bp L HE Lp wy v ce D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.00 0.85 0.60 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.1 8 ° 0 ° 0.13 0.1 0.2 0.4 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.40 0.15 Q 0.21 0.19 SOT765-1 MO-187 02-06-07 w M bp D Z e 0.12 14 8 5 θ A2 A1 Q Lp (A3) detail X A L HE E c v M A X A y 2.5 5 mm 0 scale VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 1 pin 1 index |
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