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TPIC8300IPWRQ1 Scheda tecnica(PDF) 1 Page - Texas Instruments

Il numero della parte TPIC8300IPWRQ1
Spiegazioni elettronici  PRESSURE SENSOR SIGNAL CONDITIONING INTERFACE
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
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PW PACKAGE
(TOP VIEW)
Vdd
DGnd
DI
DO
TST2
TST1
TST0
ProgV
Vcc
VccA
Gnd
REF1
GndA
SIP
Gnd
SIN
TPIC83000-Q1
www.ti.com
SLDS171 – NOVEMBER 2009
PRESSURE SENSOR SIGNAL CONDITIONING INTERFACE
Check for Samples: TPIC83000-Q1
1
FEATURES
Qualified for Automotive Applications
10-Bit Pressure and Temperature Output
On-Board Temperature Sensor
Programmable Gain / Gain TC1
Programmable Offset / Offset TC1 / TC2
On-Board EEPROM for System Calibration
Operating Temperature Range: –40°C to 85°C
16-Pin TSSOP (PW) Package
UART Interface
APPLICATIONS
Occupancy Weight Sensing
Pedal-Pressure Sensing
General Low-Pressure Sensing
DESCRIPTION
The TPIC83000 is a single-channel, signal conditioning device for pressure sensors used in low-pressure
sensing applications such as passenger occupancy indication/detection and pedal pressure sensing. The
pressure sensor can be based on either a strain gauge or piezo-resistive elements configured as a full
Wheatstone bridge. This device provides an analog signal conditioning interface between the pressure sensor
and a microcontroller. The analog front end (AFE) inside the device processes the sensed signals from the
pressure sensor by amplifying the signal and cancelling offset. This processed signal is then converted into a
14-bit, digital word using a sigma-delta analog-to-digital converter (ADC). The device also has a built-in 12-bit
ADC that is used to sense ambient temperature to compensate for the temperature coefficient of the sensor and
related processing circuitry. The compensated digital data is transferred to the microprocessor via a built-in
UART interface.
ORDERING INFORMATION(1)
TA
PACKAGE (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
TSSOP – PW
Reel of 2000
TPIC83000IPWRQ1
TPIC83000I
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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