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TPIC8300IPWRQ1 Scheda tecnica(PDF) 1 Page - Texas Instruments |
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TPIC8300IPWRQ1 Scheda tecnica(HTML) 1 Page - Texas Instruments |
1 / 44 page 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PW PACKAGE (TOP VIEW) Vdd DGnd DI DO TST2 TST1 TST0 ProgV Vcc VccA Gnd REF1 GndA SIP Gnd SIN TPIC83000-Q1 www.ti.com SLDS171 – NOVEMBER 2009 PRESSURE SENSOR SIGNAL CONDITIONING INTERFACE Check for Samples: TPIC83000-Q1 1 FEATURES • Qualified for Automotive Applications • 10-Bit Pressure and Temperature Output • On-Board Temperature Sensor • Programmable Gain / Gain TC1 • Programmable Offset / Offset TC1 / TC2 • On-Board EEPROM for System Calibration • Operating Temperature Range: –40°C to 85°C • 16-Pin TSSOP (PW) Package • UART Interface APPLICATIONS • Occupancy Weight Sensing • Pedal-Pressure Sensing • General Low-Pressure Sensing DESCRIPTION The TPIC83000 is a single-channel, signal conditioning device for pressure sensors used in low-pressure sensing applications such as passenger occupancy indication/detection and pedal pressure sensing. The pressure sensor can be based on either a strain gauge or piezo-resistive elements configured as a full Wheatstone bridge. This device provides an analog signal conditioning interface between the pressure sensor and a microcontroller. The analog front end (AFE) inside the device processes the sensed signals from the pressure sensor by amplifying the signal and cancelling offset. This processed signal is then converted into a 14-bit, digital word using a sigma-delta analog-to-digital converter (ADC). The device also has a built-in 12-bit ADC that is used to sense ambient temperature to compensate for the temperature coefficient of the sensor and related processing circuitry. The compensated digital data is transferred to the microprocessor via a built-in UART interface. ORDERING INFORMATION(1) TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING –40°C to 85°C TSSOP – PW Reel of 2000 TPIC83000IPWRQ1 TPIC83000I (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2009, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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