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ADMP405ACEZ Scheda tecnica(PDF) 8 Page - Analog Devices |
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ADMP405ACEZ Scheda tecnica(HTML) 8 Page - Analog Devices |
8 / 12 page ADMP405 Preliminary Technical Data Rev. PrH | Page 8 of 12 PCB LAND PATTERN LAYOUT The recommended PCB land pattern for the ADMP405 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 9. Care should be taken to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 10. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. Figure 9. PCB Land Pattern Layout Figure 10. Suggested Solder Paste Stencil Pattern Layout Ø1.55 Ø0.95 1.52 0.90 1.90 1.22 0.68 0.61 0.61 1.22 2× 0.8 × 0.6 0.2 × 45 TYP 1.52mm 1.55/1.05 DIA. 0.225 CUT WIDTH (2×) |
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