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LA223B-G.SEG-2-PF Scheda tecnica(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LA223B-G.SEG-2-PF Scheda tecnica(HTML) 6 Page - LIGITEK electronics co., ltd. |
6 / 7 page Page 5/6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120 °C Max Preheat time: 60seconds Max Ramp-up 2 °C/sec(max) Ramp-Down:-5 °C/sec(max) Solder Bath:260 °C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) 260 °C3sec Max 5 °/sec max 260° 120° Temp( °C) Time(sec) 150 50 100 2 °/sec max 25° 0° Preheat 0 60 Seconds Max PART NO. LA223B/G.SEG-2-PF |
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