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TLP2166A Scheda tecnica(PDF) 6 Page - Toshiba Semiconductor |
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TLP2166A Scheda tecnica(HTML) 6 Page - Toshiba Semiconductor |
6 / 11 page TLP2166A 2008-11-27 6 Specification for Embossed–Tape Packing (TP) for SO8 Coupler 1. Applicable Package Package Product Type SO8 Photocoupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) 3. Tape Dimensions 3.1 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Figure 1 Device Orientation 3.2 Tape Packing Quantity:2500 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table 1 Empty Device Recesses Standard Remarks Occurrences of 2 or more successive empty device recesses 0 Within any given 40-mm section of tape, not including leader and trailer Single empty device recesses 6 devices (max) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape. TLP2166A (TP) Device name Tape type |
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