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FAN3111 Scheda tecnica(PDF) 2 Page - Fairchild Semiconductor |
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FAN3111 Scheda tecnica(HTML) 2 Page - Fairchild Semiconductor |
2 / 18 page © 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN3111 • Rev. 1.0.1 2 Ordering Information Part Number Input Threshold Package Eco Status Packing Method Quantity per Reel FAN3111CSX CMOS 5-Pin SOT23 RoHS Tape & Reel 3,000 FAN3111ESX External 5-Pin SOT23 RoHS Tape & Reel 3,000 For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html. Thermal Characteristics (1) Package ΘJL (2) ΘJT (3) ΘJA (4) ΨJB (5) ΨJT (6) Units 5-Pin SOT23 58 102 161 53 6 °C/W Notes: 1. Estimates derived from thermal simulation; actual values depend on the application. 2. Theta_JL ( ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any thermal pad) that are typically soldered to a PCB. 3. Theta_JT ( ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform temperature by a top-side heatsink. 4. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow. The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate. 5. Psi_JB ( ΨJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an application circuit board reference point for the thermal environment defined in Note 4. For the MLP-8 package, the board reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6. 6. Psi_JT ( ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and the center of the top of the package for the thermal environment defined in Note 4. Pin Definitions Pin # Name Description 1 VDD Supply Voltage. Provides power to the IC. 2 GND Ground. Common ground reference for input and output circuits. 3 IN+ Non-Inverting Input. Connect to VDD to enable output. IN– FAN3111C Inverting Input. Connect to GND to enable output. 4 XREF FAN3111E External Reference Voltage. Reference for input thresholds, 2V to 5V. 5 OUT Gate Drive Output. Held low unless required inputs are present. Output Logic with Dual-Input Configuration IN+ IN− OUT 0 (7) 0 0 0 (7) 1 (7) 0 1 0 1 1 1 (7) 0 Note: 7. Default input signal if no external connection is made. |
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