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NBXSBA007LN1TAG Scheda tecnica(PDF) 5 Page - ON Semiconductor |
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NBXSBA007LN1TAG Scheda tecnica(HTML) 5 Page - ON Semiconductor |
5 / 6 page NBXSBA007 http://onsemi.com 5 Figure 4. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) Driver Device Receiver Device QD Q D Zo = 50 W Zo = 50 W 50 W 50 W VTT VTT = VDD − 2.0 V NBXSBA007 260 217 175 150 Temperature (°C) temp. 260°C 20 − 40 sec. max. Time 60180 sec. 3°C/sec. max. cooling 6°C/sec. max. 60150 sec. reflow peak pre−heat ramp−up Figure 5. Recommended Reflow Soldering Profile |
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