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TC1072-3.3VCH Scheda tecnica(PDF) 9 Page - TelCom Semiconductor, Inc |
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TC1072-3.3VCH Scheda tecnica(HTML) 9 Page - TelCom Semiconductor, Inc |
9 / 12 page TC1073 3 PRELIMINARY INFORMATION TC1073-01 6/5/97 100mA CMOS LDO WITH SHUTDOWN, ERROR OUTPUT AND VREF BYPASS PIN DESCRIPTION Pin No. (SOT-23A-6) Symbol Description 1VIN Unregulated supply input. 2 GND Ground terminal. 3 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.05 microamp (typical). 4 ERROR Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance by approximately – 5%. 5 Bypass Reference bypass input. Connecting a 470pF to this input further reduces output noise. 6VOUT Regulated voltage output. ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25 °C, unless otherwise noted. Symbol Parameter Test Conditions Min Typ Max Units ERROR Open Dranin Output VMIN Minimum Operating Voltage 1.0 — — V VOL Output Logic Low Voltage 1mA Flows to ERROR — — 400 mV VTH ERROR Threshold Voltage See Figure 2 — 0.95 x VR —V VHYS ERROR Positive Hysteresis Note 8 — 50 — mV NOTES: 1. VR is the regulator output voltage setting. (VR = 2.5V, 2.7V, 3.0V, 3.3V, 5.0V). 2. TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x ∆T 3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 5. Ground pin current is the regulator pass transistor gate current. The total current drawn from the input supply is the sum of the load current, ground current and supply current (i.e. IIN = ISUPPLY + IGND + ILOAD). 6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec. 7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, qJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details. 8. Hysteresis voltage is referenced by VR. 9. Boldface type specifications apply for junction temperatures of – 40 °C to +125°C. |
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