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FGB30N6S2 Scheda tecnica(PDF) 8 Page - Fairchild Semiconductor |
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FGB30N6S2 Scheda tecnica(HTML) 8 Page - Fairchild Semiconductor |
8 / 11 page ©2001 Fairchild Semiconductor Corporation FGH30N6S2 / FGP30N6S2 / FGS30N6S2 Rev. A TO-247 3 LEAD JEDEC STYLE TO-247 PLASTIC PACKAGE A b b1 c D E L L1 ØR 12 e1 31 J1 ØS Q ØP BACK VIEW TERM. 4 3 e b2 2 SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A 0.180 0.190 4.58 4.82 - b 0.046 0.051 1.17 1.29 2, 3 b1 0.060 0.070 1.53 1.77 1, 2 b2 0.095 0.105 2.42 2.66 1, 2 c 0.020 0.026 0.51 0.66 1, 2, 3 D 0.800 0.820 20.32 20.82 - E 0.605 0.625 15.37 15.87 - e 0.219 TYP 5.56 TYP 4 e1 0.438 BSC 11.12 BSC 4 J1 0.090 0.105 2.29 2.66 5 L 0.620 0.640 15.75 16.25 - L1 0.145 0.155 3.69 3.93 1 ØP 0.138 0.144 3.51 3.65 - Q 0.210 0.220 5.34 5.58 - ØR 0.195 0.205 4.96 5.20 - ØS 0.260 0.270 6.61 6.85 - NOTES: 1. Lead dimension and finish uncontrolled in L1. 2. Lead dimension (without solder). 3. Add typically 0.002 inches (0.05mm) for solder coating. 4. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimen- sion D. 5. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimen- sion D. 6. Controlling dimension: Inch. 7. Revision 1 dated 1-93. |
Codice articolo simile - FGB30N6S2 |
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Descrizione simile - FGB30N6S2 |
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