Motore di ricerca datesheet componenti elettronici |
|
LCDA15C-8.TBT Scheda tecnica(PDF) 4 Page - Semtech Corporation |
|
LCDA15C-8.TBT Scheda tecnica(HTML) 4 Page - Semtech Corporation |
4 / 6 page 4 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LCDA12C-8 and LCDA15C-8 Device Connection Options for Protection of Eight High-Speed Data Lines The LCDAxxC-8 may be configured to protect up to eight I/O lines operating between 5 and 15V. It may be used to protect the most popular serial data interface standard lines making it ideal for use in equipment utilizing multi-mode transceivers. The LCDAxxC-8 is symmetrical so the data lines may be connected at pins 1-8 or 9-16. Pins 9-16 or 1-8 are connected to ground as shown. For best results, these pins should be connected directly to a ground plane on the board. The path length should be kept as short as possible to minimize parasitic inductance. Multi-Mode Transceiver Protection The LCDAxxC-8 may be used to protect multi-mode transceiver I/O lines with external connections. The LCDAxxC-8 adds a maximum loading capacitance of 15pF with a working voltage of 12V or 15V. This allows the transceiver to safely operate in all modes without clipping or degradation of the signal. With proper design and layout, the transceiver port can be protected to >15kV (HBM per IEC 61000-4-2). Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended: Place the LCDAxxC-8 near the input terminals or connectors to restrict transient coupling. Minimize the path length between the LCDAxxC-8 and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Device Connection Applications Information Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. |
Codice articolo simile - LCDA15C-8.TBT |
|
Descrizione simile - LCDA15C-8.TBT |
|
|
Link URL |
Privacy Policy |
ALLDATASHEETIT.COM |
Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |