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CS4953XX Scheda tecnica(PDF) 11 Page - Cirrus Logic |
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CS4953XX Scheda tecnica(HTML) 11 Page - Cirrus Logic |
11 / 34 page CS4953xx Data Sheet 32-bit Audio Decoder DSP Family DS705PP3 Copyright 2008 Cirrus Logic 11 5.4 Power Supply Characteristics (measurements performed under operating conditions) 5.5 Thermal Data (144 LQFP) 5.6 Thermal Data (128 LQFP) Notes: 1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20 % of the top & bottom layers. 2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20 % of the top & bottom layers and 0.5-oz copper covering 90 % of the internal power plane and ground plane layers. 3. To calculate the die temperature for a given power dissipation 4. Τ j = Ambient Temperature + [ (Power Dissipation in Watts) * θ ja ] 5. To calculate the case temperature for a given power dissipation 6. Τ c = Τ j - [ (Power Dissipation in Watts) * ψ jt ] 5.7 Switching Characteristics— RESET Parameter Min Typ Max Unit Power supply current: Core and I/O operating: VDD1 PLL operating: VDDA With external memory and most ports operating: VDDIO 1. Dependent on application firmware and DSP clock speed. - - - 500 3.5 120 - - - mA mA mA Parameter Symbol Min Typ Max Unit Thermal Resistance (Junction to Ambient) Two-layer Board1 Four-layer Board2 θ ja - - 48 40 - - °C / Watt Thermal Resistance (Junction to Top of Package) Two-layer Board1 Four-layer Board2 ψ jt - - .39 .33 - - °C / Watt Parameter Symbol Min Typ Max Unit Thermal Resistance (Junction to Ambient) Two-layer Board1 Four-layer Board2 θ ja - - 53 44 - - °C / Watt Thermal Resistance (Junction to Top of Package) Two-layer Board1 Four-layer Board2 ψ jt - - .45 .39 - - °C / Watt Parameter Symbol Min Max Unit RESET# minimum pulse width low Trstl 1- μs All bidirectional pins high-Z after RESET# low Trst2z -100 ns Configuration pins setup before RESET# high Trstsu 50 - ns Configuration pins hold after RESET# high Trsthld 20 - ns |
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