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MC33981 Scheda tecnica(PDF) 4 Page - Freescale Semiconductor, Inc |
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MC33981 Scheda tecnica(HTML) 4 Page - Freescale Semiconductor, Inc |
4 / 37 page Analog Integrated Circuit Device Data 4 Freescale Semiconductor 33981 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit ELECTRICAL RATINGS Power Supply Voltage Steady-state VPWR -16 to 41 V Input/Output Pins Voltage(1) INHS, INLS, CONF, CSNS, FS, TEMP, EN -0.3 to 7.0 V Output Voltage Positive Negative VOUT 41.0 -5.0 V Continuous Output Current(2) IOUT 40.0 A CSNS Input Clamp Current ICL(CSNS) 15.0 mA EN Input Clamp Current ICL(EN) 2.5 mA SR Voltage VSR -0.3 to 54.0 V CBOOT Voltage CBOOT -0.3 to 54.0 V OCLS Voltage VOCLS -5.0 to 7.0 V Low Side Gate Voltage VGLS -0.3 to 15.0 V Low Side Drain Voltage VDLS -5.0 to 41.0 V ESD Voltage(3) Human Body Model (HBM) Charge Device Model (CDM) Corner Pins (1, 12, 15, 16) All Other Pins (2-11, 13-14) VESD ±2000 ±750 ±500 V THERMAL RATINGS Operating Temperature Ambient Junction TA TJ -40 to 125 -40 to 150 °C Storage Temperature TSTG -55 to 150 °C Thermal Resistance(4) Junction to Power Die Case Junction to Ambient RθJC RθJA 1.0 30.0 °C/W Peak Package Reflow Temperature During Reflow(5), (6) TPPRT Note 6 °C Notes 1. Exceeding voltage limits on INHS, INLS, CONF, CSNS, FS, TEMP, and EN pins may cause a malfunction or permanent damage to the device. 2. Continuous high side output rating as long as maximum junction temperature is not exceeded. Calculation of maximum output current using package thermal resistance is required. 3. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω) and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF). 4. Device mounted on a 2s2p test board per JEDEC JESD51-2. 5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. |
Codice articolo simile - MC33981 |
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Descrizione simile - MC33981 |
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