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SI5933CDC Scheda tecnica(PDF) 1 Page - Vishay Siliconix

Il numero della parte SI5933CDC
Spiegazioni elettronici  Dual P-Channel 20-V (D-S) MOSFET
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Produttore elettronici  VISHAY [Vishay Siliconix]
Homepage  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

SI5933CDC Scheda tecnica(HTML) 1 Page - Vishay Siliconix

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Vishay Siliconix
Si5933CDC
New Product
Document Number: 68822
S-81731-Rev. A, 04-Aug-08
www.vishay.com
1
Dual P-Channel 20-V (D-S) MOSFET
FEATURES
TrenchFET® Power MOSFET
100 % Rg Tested
APPLICATIONS
Load Switch for Portable Devices
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)ID (A)
a
Qg (Typ.)
- 20
0.144 at VGS = - 4.5 V
- 3.7
4.1 nC
0.180 at VGS = - 2.5 V
- 3.0
0.222 at VGS = - 1.8 V
- 3.0
Ordering Information: Si5933CDC-T1-E3 (Lead (Pb)-free)
Marking Code
XXX
Lot Traceability
and Date Code
Part #
Code
DI
1206-8 ChipFET
®
Bottom View
S1
G1
S2
G2
D1
D1
D2
D2
1
S1
G1
D1
P-Channel MOSFET
S2
G2
D2
P-Channel MOSFET
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required
to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 130 °C/W.
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
- 20
V
Gate-Source Voltage
VGS
± 8
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
ID
- 3.7
A
TC = 70 °C
- 3.0
TA = 25 °C
- 2.5b, c
TA = 70 °C
- 2.0b, c
Pulsed Drain Current
IDM
- 10
Continuous Source-Drain Diode Current
TC = 25 °C
IS
- 2.3
TA = 25 °C
- 1.1b, c
Maximum Power Dissipation
TC = 25 °C
PD
2.8
W
TC = 70 °C
1.8
TA = 25 °C
1.3b, c
TA = 70 °C
0.8b, c
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)d, e
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambientb, f
t
≤ 5 s
RthJA
82
99
°C/W
Maximum Junction-to-Foot (Drain)
Steady State
RthJF
35
45
RoHS
COMPLIANT


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