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MCZ33879AEKR2 Scheda tecnica(PDF) 10 Page - Freescale Semiconductor, Inc |
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MCZ33879AEKR2 Scheda tecnica(HTML) 10 Page - Freescale Semiconductor, Inc |
10 / 25 page Analog Integrated Circuit Device Data 10 Freescale Semiconductor 33879 ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 5. Dynamic Electrical Characteristics Characteristics noted under conditions 3.1V ≤ V DD ≤ 5.5V, 5.5V ≤ VPWR ≤ 18V, -40°C ≤ TC ≤ 125°C, unless otherwise noted. Where applicable, typical values reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25°C. Characteristic Symbol Min Typ Max Unit POWER OUTPUT TIMING Output Slew Rate Low Side Configuration(11) RLOAD = 620Ω, CL = 200pF tSR(RISE) 0.1 0.5 1.0 V/ μs Output Slew Rate Low Side Configuration(11) RLOAD = 620 Ω, CL = 200 pF tSR(FALL) 0.1 0.5 1.0 V/ μs Output Rise Time High Side Configuration(11) RLOAD = 620Ω, CL = 200pF tSR(RISE) 0.1 0.3 1.0 V/ μs Output Fall Time High Side Configuration(11) RLOAD = 620Ω, CL = 200pF tSR(FALL) 0.1 0.3 1.0 V/ μs Output Turn ON Delay Time, High Side and Low Side Configuration(12) tDLY(ON) 1.0 15 50 μs Output Turn OFF Delay Time, High Side and Low Side Configuration(12) tDLY(OFF) 1.0 30 100 μs Output Fault Delay Time(13) tFAULT 100 – 300 μs Power-ON Reset Delay Delay Time Required from Rising Edge of EN and V DD to SPI Active tPOR 100 – – μs Low-State Duration on V DD or EN for Reset V DD or EN ≤ 0.2 V tRESET 100 – – µs Notes 11. Output slew rate respectively measured across a 620 Ω resistive load at 10 to 90 percent and 90 to 10 percent voltage points. C L capacitor is connected from Drain or Source output to Ground. 12. Output turn ON and OFF delay time measured from 50 percent rising edge of CS to the beginning of the 10 and 90 percent transition points. 13. Duration of fault before fault bit is set. Duration between access times must be greater than 300 μs to read faults. |
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