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FAN5632 Scheda tecnica(PDF) 4 Page - Fairchild Semiconductor |
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FAN5632 Scheda tecnica(HTML) 4 Page - Fairchild Semiconductor |
4 / 13 page © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5631/FAN5632 Rev. 1.0.2 4 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VIN to GND -0.3 6.0 VCC All other pins to GND -0.3 VIN + 0.3 V ILOAD Load Current 0.5 A Θ JC Thermal Resistance Junction-to-Tab (1) 8 °C/W TL Lead Temperature, Soldering 10 Seconds +260 °C TJ Junction Temperature -40 +150 °C TSTG Storage Temperature -65 +150 °C Human Body Model, JESD22-A114 2.5 ESD (2) Charged Device Model, JESD22-C101 0.2 kV Notes: 1. Junction-to-ambient thermal resistance, θ JA, is a strong function of PCB material, board thickness, thickness and number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics. The estimated value for zero air flow at 0.5W is 60°C/W. 2. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charged Device Model). Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Typ. Max. Unit VCC Supply Voltage Range 2.2 5.5 V IOUT Output Current (VIN > 2.V) 250 mA TA Operating Ambient Temperature Range -40 +25 +85 °C |
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