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STA333ML Scheda tecnica(PDF) 9 Page - STMicroelectronics |
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STA333ML Scheda tecnica(HTML) 9 Page - STMicroelectronics |
9 / 14 page STA333ML Package thermal characteristics 9/14 5 Package thermal characteristics The amount of power dissipated within the device depends primarily on the supply voltage, load impedance and output modulation level. For the STA333ML the maximum dissipated power is approximately 3 W. Thus, at an ambient temperature of 70 °C (the generally recommended maximum for consumer applications) the device can tolerate a further temperature rise of around 80° C before thermal shutdown is invoked (at Tj = 150° C). A suitable heatsink must, therefore, be found. Now, a thermal resistance of 25° C/W can be achieved using a ground copper area of 3x3cm2, and 16 vias, on the PCB as shown in Figure 6. This gives a tiny margin of safety near to the upper recomended operating limits. Figure 6. Using the PCB as heatsink |
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