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L6933H12 Scheda tecnica(PDF) 10 Page - STMicroelectronics |
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L6933H12 Scheda tecnica(HTML) 10 Page - STMicroelectronics |
10 / 12 page Package mechanical data L6933H1.2 10/12 9 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 8. SO-8 mechanical data Dim. mm. inch Min Typ Max Min Typ Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.10 1.65 0.043 0.065 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D (1) 1. Dimensions D does not include mold flash, protru-sions or gate burrs. Mold flash, potrusions or gate burrs shall not exceed 0.15mm (.006inch) in total (both side). 4.80 5.00 0.189 0.197 E 3.80 4.00 0.15 0.157 e 1.27 0.050 H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 k 0° (min.), 8° (max.) ddd 0.10 0.004 Figure 9. Package dimensions |
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