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SMP100-230 Scheda tecnica(PDF) 2 Page - STMicroelectronics |
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SMP100-230 Scheda tecnica(HTML) 2 Page - STMicroelectronics |
2 / 9 page Symbol Parameter Value Unit Rth(j-I) Junction to leads 20 °C/W Rth(j-a) Junction to ambient on printed circuit (with standard footprint dimensions) 100 °C/W THERMAL RESISTANCES Symbol Parameter Value Unit Ipp Peak pulse current: 10/1000 µs (open circuit voltage waveform 1 kV 10/1000 µs) 5/310 µs (open circuit voltage waveform 4 kV, 10/700 µs) 8/20 µs (open circuit voltage waveform 4 kV 1.2/50 µs) 2/10 µs (open circuit voltage waveform 2.5kV 2/10 µs) 100 150 250 500 A A A A IFS Fail-safe mode 8/20 µs5 kA ITSM Non repetitive surge peak on-state current One cycle 50Hz 60Hz 55 60 A A Non repetitive surge peak on-state current F = 50Hz 0.2s 2s 25 12 A A TL Maximum lead temperature for soldering during 10s 260 °C Tstg Tj Storage temperature range Maximum junction temperature - 55 to + 150 150 °C °C ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C) 100 50 %IPP t t r p 0 t Note 1: Pulse waveform 10 / 1000 µstr = 10 µs tp = 1000 µs 8/ 20 µstr = 8 µstp = 20 µs 5 / 310 µstr = 5 µs tp = 310 µs 1/ 20 µstr = 1 µstp = 20 µs 2/ 10 µstr = 2 µstp = 10 µs SMP100-xxx 2/9 |
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