Motore di ricerca datesheet componenti elettronici |
|
TLC2201ACDRG4 Scheda tecnica(PDF) 6 Page - Texas Instruments |
|
|
TLC2201ACDRG4 Scheda tecnica(HTML) 6 Page - Texas Instruments |
6 / 64 page TLC220x, TLC220xA, TLC220xB, TLC220xY Advanced LinCMOS ™ LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS SLOS175 – FEBRUARY 1997 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC2202Y chip formation This chip, when properly assembled, displays characteristics similar to the TLC2202C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VDD+ (8) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (4) VDD– 100 80 (1) (2) (3) (4) (5) (6) (7) (8) |
Codice articolo simile - TLC2201ACDRG4 |
|
Descrizione simile - TLC2201ACDRG4 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEETIT.COM |
Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |