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IRL3705ZLPBF Scheda tecnica(PDF) 1 Page - International Rectifier |
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IRL3705ZLPBF Scheda tecnica(HTML) 1 Page - International Rectifier |
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1 / 13 page  07/20/04 www.irf.com 1 AUTOMOTIVE MOSFET PD - 95579 HEXFET® Power MOSFET VDSS = 55V RDS(on) = 8.0mΩ ID = 75A Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on- resistance per silicon area. Additional features of this design are a 175°C junction operating tempera- ture, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications. S D G Description Features l Logic Level l Advanced Process Technology l Ultra Low On-Resistance l 175°C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax l Lead-Free IRL3705ZPbF IRL3705ZSPbF IRL3705ZLPbF D2Pak IRL3705ZS TO-220AB IRL3705Z TO-262 IRL3705ZL Absolute Maximum Ratings Parameter Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) ID @ TC = 100°C Continuous Drain Current, VGS @ 10V A ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited) IDM Pulsed Drain Current PD @TC = 25°C Power Dissipation W Linear Derating Factor W/°C VGS Gate-to-Source Voltage V EAS (Thermally limited) Single Pulse Avalanche Energy d mJ EAS (Tested ) Single Pulse Avalanche Energy Tested Value h IAR Avalanche Current à A EAR Repetitive Avalanche Energy g mJ TJ Operating Junction and TSTG Storage Temperature Range °C Soldering Temperature, for 10 seconds Mounting Torque, 6-32 or M3 screw i Thermal Resistance Parameter Typ. Max. Units RθJC Junction-to-Case ––– 1.14 °C/W RθCS Case-to-Sink, Flat Greased Surface i 0.50 ––– RθJA Junction-to-Ambient i ––– 62 RθJA Junction-to-Ambient (PCB Mount) j ––– 40 -55 to + 175 300 (1.6mm from case ) 10 lbf yin (1.1Nym) 130 0.88 ± 16 Max. 86 61 340 75 180 120 See Fig.12a, 12b, 15, 16 |
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