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OP250GBC Scheda tecnica(PDF) 5 Page - Analog Devices |
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OP250GBC Scheda tecnica(HTML) 5 Page - Analog Devices |
5 / 5 page This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Analog Devices assumes no obligation regarding future manufacture unless otherwise agreed to in writing. OP150/OP250/OP450 REV. 0 PRELIMINARY TECHNICAL DATA –5– DICE CHARACTERISTICS OP150 Die Size 0.00 × 0.00 Inch, 00 Sq. Mils Substrate (Die Backside) Is Connected to V– Transistor Count, 00. OP250 Die Size 0.044 × 0.045 Inch, 1,980 Sq. Mils Substrate (Die Backside) Is Connected to V– Transistor Count, 0. OP450 Die Size 0.052 × 0.058 Inch, 3,016 Sq. Mils Substrate (Die Backside) Is Connected to V– Transistor Count, 127. R LOAD – Ω 2.5 2.0 0 0 200 20 40 60 80 100 120 140 160 180 1.5 1.0 0.5 VOL VOH Figure 1. ±V OUT vs. RLOAD OBSOLETE |
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