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STPS10170CG Scheda tecnica(PDF) 8 Page - STMicroelectronics |
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STPS10170CG Scheda tecnica(HTML) 8 Page - STMicroelectronics |
8 / 10 page Package dimensions STPS10170C 8/10 Figure 13. D2PAK footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 7. D2PAK dimensions Ref. Dimensions Millimeters Inches Min. Max Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R 0.40 typ. 0.016 typ. V2 0° 8° 0° 8° G L3 L2 B B2 E * FLAT ZONE NO LESS THAN 2mm A C2 D R A2 M V2 C A1 * 16.90 10.30 8.90 3.70 5.08 1.30 |
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