Specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Tel: +44 (0) 1325 301111

Fax: +44 (0) 1325 306177

FMA3051

Pilot Datasheet v2.1

North and South are biased separately, only one side is represented. Please refer to the

Assembly diagram below for surface mount components locations.

4

C1

Capacitor, 100 nF, surface mount 0402

8

C2

Capacitor, 100 pF, single layer, to epoxy in cavity

8

C3

Capacitor, 10 nF, surface mount 0402

2

L1

Inductor, 10 nH, surface mount 0402

2

Bond

Bondwire

–

R1

Resistor, 1 k

Ω, surface mount 0402

2

R2

Resistor, 1.5 k

Ω, surface mount 0402

2

D1

D2

D3

D4

G2 G3 G4

Bond

Bond

C1

C2

Vdd

Bond

Bond

Vdd

Bond

Bond

C2

C1

C1

C2

Vg

Bond

Bond

C2

C3

L1

C1

Vdd

DET PAD N

Q1 PAD O

R1

R2

4.5 V

Detected voltage

R1

R2

Reference voltage

4.5 V