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SN74AUP1G57DBVRG4 Scheda tecnica(PDF) 2 Page - Texas Instruments

Il numero della parte SN74AUP1G57DBVRG4
Spiegazioni elettronici  LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
Logo TI - Texas Instruments

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DESCRIPTION/ORDERING INFORMATION (CONTINUED)
3
1
6
In2
In1
In0
4
Y
SN74AUP1G57
LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE
SCES503G – NOVEMBER 2003 – REVISED APRIL 2007
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
ORDERABLE PART
TA
PACKAGE(1)(2)
TOP-SIDE MARKING(3)
NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YFP
Reel of 3000
SN74AUP1G57YFPR
PREVIEW
(Pb-free)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
Reel of 3000
SN74AUP1G57YZPR
_ _ _HH_
(Pb-free)
–40
°C to 85°C
SON – DRY
Reel of 5000
SN74AUP1G57DRYR
PREVIEW
SOT (SOT-23) – DBV
Reel of 3000
SN74AUP1G57DBVR
HA7_
SOT (SC-70) – DCK
Reel of 3000
SN74AUP1G57DCKR
HH_
SOT (SOT-553) – DRL
Reel of 4000
SN74AUP1G57DRLR
HH_
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the
TI website at www.ti.com.
(2)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(3)
DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YFP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
• = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUT
Y
In2
In1
In0
L
L
L
H
L
L
H
L
L
H
L
H
L
H
H
L
H
L
L
L
H
L
H
L
H
H
L
H
H
H
H
H
LOGIC DIAGRAM (POSITIVE LOGIC)
2
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