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TLPGU13DP Scheda tecnica(PDF) 2 Page - Toshiba Semiconductor |
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TLPGU13DP Scheda tecnica(HTML) 2 Page - Toshiba Semiconductor |
2 / 7 page TLGU13CP(F),TLGU13DP(F),TLPGU13CP(F),TLPGU13DP(F) 2007-10-01 2 Electrical and Optical Characteristics (Ta = 25°C) Typ. Emission Wavelength Luminous Intensity IV Forward Voltage VF Reverse Current IR Product Name λd λP Δλ IF Min Typ. IF Typ. Max IF Max VR TLGU13CP(F) 571 (574) 17 20 47.6 120 20 2.1 2.4 20 50 4 TLGU13DP(F) 571 (574) 17 20 27.2 70 20 2.1 2.4 20 50 4 TLPGU13CP(F) 558 (562) 14 20 27.2 80 20 2.1 2.4 20 50 4 TLPGU13DP(F) 558 (562) 14 20 15.3 35 20 2.1 2.4 20 50 4 Unit nm mA mcd mA V mA μA V Precautions Please be careful of the following: • Soldering temperature: 260°C max, soldering time: 3 s max (soldering portion of lead: up to 1.6 mm from the body of the device) • If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress to the resin. Soldering should be performed after lead forming. • This visible LED lamp also emits some IR light. If a photo detector is located near the LED lamp, please ensure that it will not be affected by this IR light |
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