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TLP719 Scheda tecnica(PDF) 2 Page - Toshiba Semiconductor |
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TLP719 Scheda tecnica(HTML) 2 Page - Toshiba Semiconductor |
2 / 7 page TLP719 2007-10-01 2 Absolute Maximum Ratings (Ta = 25 °C) Characteristic Symbol Rating Unit Forward current (Note 1) IF 25 mA Pulse forward current (Note 2) IFP 50 mA Peak transient forward current (Note 3) IFPT 1 A Reverse voltage VR 5 V Diode power dissipation (Note 4) PD 45 mW Junction temperature Tj 125 °C Output current IO 8 mA Peak output current IOP 16 mA Output voltage VO −0.5~20 V Supply voltage VCC −0.5~30 V Output power dissipation (Note 5) PO 100 mW Junction Temperature Tj 125 °C Operating temperature range Topr −55~100 °C Storage temperature range Tstg −55~125 °C Lead soldering temperature (10 s) Tsol 260 °C Isolation voltage (AC, 1 minute, R.H.≤ 60 %) (Note 6) BVS 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Derate 0.45 mA / °C above 70 °C. Note 2: 50% duty cycle, 1 ms pulse width. Derate 0.9 mA / °C above 70 °C. Note 3: Pulse width ≤ 1 μs, 300 pps. Note 4: Derate 0.8 mW / °C above 70 °C. Note 5: Derate 1.8 mW / °C above 70 °C. Note 6: Device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively. Note 7: A ceramic capacitor (0.1 μF) should be connected from pin 6 to pin 4 to stabilize the operation of the high-gain linear amplifier. Failure to provide the bypassing may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm. |
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