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74LVC3G34GT Scheda tecnica(PDF) 11 Page - NXP Semiconductors |
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74LVC3G34GT Scheda tecnica(HTML) 11 Page - NXP Semiconductors |
11 / 14 page 74LVC3G34_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 5 October 2007 11 of 14 NXP Semiconductors 74LVC3G34 Triple buffer Fig 12. Package outline SOT902-1 (XQFN8) REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT902-1 MO-255 - - - - - - SOT902-1 05-11-16 05-11-25 UNIT A max mm 0.5 A1 0.25 0.15 0.05 0.00 1.65 1.55 0.35 0.25 0.15 0.05 DIMENSIONS (mm are the original dimensions) XQFN8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm b DL e1 1.65 1.55 e E L1 v 0.1 0.55 0.5 w 0.05 y 0.05 0.05 y1 0 1 2 mm scale X C y C y1 terminal 1 index area terminal 1 index area B A D E detail X A A1 b 8 7 6 5 e1 e1 e e A C B ∅ v M C ∅ w M 4 1 2 3 L L1 metal area not for soldering |
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