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STK14C88-L Scheda tecnica(PDF) 1 Page - Simtek Corporation |
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STK14C88-L Scheda tecnica(HTML) 1 Page - Simtek Corporation |
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1 / 2 page  This package type is not available in a lead-free version. Detail Unit 28 350 LEADLESS CHIP CARRIER 32 450 LEADLESS CHIP CARRIER PACKAGE MATERIALS Simtek Package ID L [hot solder dip lead finish] L [hot solder dip lead finish] Pin/Lead Count 28 32 Simtek package pn STK-91-01-2303 STK-91-01-3202 Package Manufacturer Kyocera NTK Technical Ceramics Mfg Pkg ID/Simtek part ID/Dwg ID PB-CA1771 / STK-91-01-2803 IRK32F1-5379C / STK-91-01-3202 Simtek package Outline STK-40-05-007 STK-40-05-011 JEDEC Case Outline MO-041 MO-041 Mil Case Outline ID Figure C11, CQCC3-N28 Figure C11, CQCC3-N32 Assembly Facility Amkor Technologies Amkor Technologies Plant ATP1 ATP1 Leadframe Plating Gold Plate 60µ" min over 80-250µ" Nickel Gold Plate 80µ" min Over 50-350µ" Nickel Plating Process Electrolytic Electrolytic Ceramic Kyocera 440 Black [Al2O3 90%] NTK ALN Leads Alloy 42 [Fe 58% / Ni 42%] Alloy 42 [Fe 58% / Ni 42%] Lead Plating [Gold Underplate] Gold Plate 80µ" Gold Plate 80µ" Leads [Hot Solder Dip Finish] Sn/Pb 60/40% Sn/Pb 60/40% PACKAGE DIMENSIONS & CHARACTERISTICS Nominal Cavity Volume in 3 .0035 .0062 Die Size mil 146x153x19 144x374x19 Pad Size mil 214x205 310x440 Theta Ja [still air] -approx C/W 98 73 Theta Ja [200fpm/1mps] - approx C/W 55 42 Theta Jc C/W 33 Lead Resistance 800 mOhm Max 500 mOhm Max Lead to Lead Capacitance pF 3pF max [1MHz] 3pF max [1MHz] SHIPPING INFORMATION Carrier Type rail rail Units Per Rail qty 34 34 Total Product Weight gm 0.9 1.3 LID DETAIL Manufacturer Williams Advanced Materials Williams Advanced Materials Lid Type Hi Rel Lid with Preform Hi Rel Lid with Preform Simtek Lid ID STK-92-10-0003 STK-92-10-0007 Dimensions in .330x.530 .280x.480 .01" .430x.530 .360x.500 .01 " Lid Material Kovar [Fe 54% / Co 17% / Ni 29%] Kovar [Fe 54% / Co 17% / Ni 29%] Plating µ" Gold 25µ" min on Nickel 50-350µ" Gold 25µ" min on Nickel 50-350µ" Plating Process Electrolytic Electrolytic Frame Au 80% / Sn 20% Au 80% / Sn 20% Frame Thickness in .002" .002" Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L PL0122 Simtek Corporation August 07 |
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