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MC145407DW Scheda tecnica(PDF) 8 Page - LANSDALE Semiconductor Inc. |
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MC145407DW Scheda tecnica(HTML) 8 Page - LANSDALE Semiconductor Inc. |
8 / 8 page www.lansdale.com Page 8 of 8 Issue A LANSDALE Semiconductor, Inc. ML145407 OUTLINE DIMENSIONS P DIP 20 = RP PLASTIC DIP (ML145407RP) CASE 738–03 1.070 0.260 0.180 0.022 0.070 0.015 0.140 15 ° 0.040 1.010 0.240 0.150 0.015 0.050 0.008 0.110 0 ° 0.020 25.66 6.10 3.81 0.39 1.27 0.21 2.80 0 ° 0.51 27.17 6.60 4.57 0.55 1.77 0.38 3.55 15 ° 1.01 0.050 BSC 0.100 BSC 0.300 BSC 1.27 BSC 2.54 BSC 7.62 BSC INCHES MILLIMETERS DIM A B C D E F G J K L M N NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. -A- C K N E GF D 20 PL J 20 PL L M -T- SEATING PLANE 110 20 11 0.25 (0.010) T A M M 0.25 (0.010) T B M M B SOG 20 = -6P SOG PACKAGE (ML145407-6P) CASE 751D–04 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. –A– –B– 20 1 11 10 S A M 0.010 (0.25) B S T D 20X M B M 0.010 (0.25) P 10X J F G 18X K C –T– SEATING PLANE M R X 45 DIM MIN MAX MIN MAX A 12.65 12.95 0.499 0.510 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029 Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabil- ity, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the cus- tomer’s technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc. |
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