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STPS8H100F Scheda tecnica(PDF) 4 Page - STMicroelectronics |
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STPS8H100F Scheda tecnica(HTML) 4 Page - STMicroelectronics |
4 / 8 page STPS8H100D/F/G/R/FP 4/8 1 10 100 100 200 500 1000 VR(V) C(nF) F=1MHz Tj=25°C Fig. 6: Junction capacitance versus reverse volt- age applied (typical values). 0 4 8 12 16 20 24 28 32 36 40 0 10 20 30 40 50 60 70 80 S(Cu) (cm²) Rth(j-a) (°C/W) Fig. 8: Thermal resistance junction to ambient ver- sus copper surface under tab (Epoxy printed cir- cuit board FR4, copper thickness: 35 µm)(D2PAK). 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0.1 1.0 10.0 50.0 VFM(V) IFM(A) Tj=25°C Tj=125°C Fig. 7: Forward voltage drop versus forward cur- rent (maximum values). |
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