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AD8506ARMZ Scheda tecnica(PDF) 10 Page - Analog Devices |
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AD8506ARMZ Scheda tecnica(HTML) 10 Page - Analog Devices |
10 / 10 page AD8506 Preliminary Technical Data Rev. PrA | Page 10 of 10 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-187-AA 0.80 0.60 0.40 8° 0° 4 8 1 5 PIN 1 0.65 BSC SEATING PLANE 0.38 0.22 1.10 MAX 3.20 3.00 2.80 COPLANARITY 0.10 0.23 0.08 3.20 3.00 2.80 5.15 4.90 4.65 0.15 0.00 0.95 0.85 0.75 Figure 8. 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters SEATING PLANE 0.50 BALL PITCH 1.480 1.430 1.380 1.825 1.775 1.725 0.27 0.24 0.21 0.380 0.355 0.330 0.340 0.320 0.300 0.675 0.595 0.515 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) A 1 2 3 B C BALL 1 IDENTIFIER Figure 9. 8-Ball Wafer Level Chip Scale Package [WLCSP] (CB-8-1) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option AD8506ARMZ1 –40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 AD8506ACBZ1 –40°C to +125°C 8-Ball Wafer Level Chip Scale Package [WLCSP] CB-8-1 1 Z = RoHS Compliant Part. ©2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. PR06900-0-8/07(PrA) |
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