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TDA8552T Scheda tecnica(PDF) 5 Page - NXP Semiconductors

Il numero della parte TDA8552T
Spiegazioni elettronici  2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
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Produttore elettronici  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA8552T Scheda tecnica(HTML) 5 Page - NXP Semiconductors

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1998 Jun 02
5
Philips Semiconductors
Preliminary specification
2
× 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing
TDA8552T; TDA8552TS
PINNING
Note
1. For the SO20 (SOT163-1) package only: the ground
pins 1, 10, 11 and 20 are mechanically connected to
the leadframe and electrically to the substrate of the
die. On the PCB the ground pins can be connected to
a copper area to decrease the thermal resistance.
SYMBOL
PIN(1)
DESCRIPTION
GND1
1
ground 1, substrate/leadframe
OUT2+
2
positive loudspeaker terminal
output channel 2
VDD1
3
supply voltage 1
HPS
4
digital input for headphone
sensing
MODE
5
digital trinary input for mode
selection (standby, mute and
operating)
UP/DOWN1
6
digital trinary input for volume
control channel 1
UP/DOWN2
7
digital trinary input for volume
control channel 2
VDD2
8
supply voltage 2
OUT2
−
9
negative loudspeaker terminal
output channel 2
GND2
10
ground 2, substrate/leadframe
GND3
11
ground 3, substrate/leadframe
OUT1+
12
positive loudspeaker terminal
output channel 1
VDD3
13
supply voltage 3
GAINSEL
14
digital input for gain selection
IN2
15
audio input channel 2
SVR
16
half supply voltage, decoupling
ripple rejection
IN1
17
audio input channel 1
VDD4
18
supply voltage 4
OUT1
−
19
negative loudspeaker terminal
output channel 1
GND4
20
ground 4, substrate/leadframe
Fig.2 Pin configuration.
handbook, halfpage
GND1
OUT2
+
VDD1
HPS
MODE
UP/DOWN1
UP/DOWN2
VDD2
OUT2
−
GND2
GND4
OUT1
−
VDD4
IN1
IN2
GAINSEL
SVR
VDD3
OUT1
+
GND3
1
2
3
4
5
6
7
8
9
10
11
12
20
19
18
17
16
15
14
13
TDA8552T
MGM610


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