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TDA8551T Scheda tecnica(PDF) 8 Page - NXP Semiconductors

Il numero della parte TDA8551T
Spiegazioni elettronici  1 W BTL audio amplifier with digital volume control
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Produttore elettronici  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA8551T Scheda tecnica(HTML) 8 Page - NXP Semiconductors

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1998 Feb 23
8
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
TEST AND APPLICATION INFORMATION
Fig.4 Test and application circuit.
handbook, full pagewidth
MGM560
20 k
TDA8551
5 k
8
15 k
15 k
C2
100
µF
C4
220
µF
C1
330 nF
C5
100 nF
C3
100
nF
2.2 k
R1
STANDBY/
MUTE/
OPERATING
VOLUME
CONTROL
27
R
R
8
5
3
operating
standby
VP
mute
UP
DOWN
volume
control
1
6
4
VP
VP
VP = 5 V
VP
Vi
SLAVE
MASTER
OUT
+
GND
MODE
OUT
IN
SVR
UP/DOWN
Reduction of the value of capacitor C2 results in a
decrease of the SVRR performance at low frequencies
(see Fig.9).
The UP/DOWN pin can be driven by a 3-state logic output
stage (microcontroller) without extra external components.
If the UP/DOWN pin is driven by push-buttons, then it is
advised to have an RC filter between the buttons and the
UP/DOWN pin. Advised values for the RC filter are 2.2 k
and 100 nF.
The volume control circuit responds to the trailing edge of
the pulse on the volume pin; connecting to VP results in a
one step (1.25 dB) higher gain; connecting to ground
results in a one step lower gain.
To avoid audible plops while switching the supply voltage
on and off pin MODE has to be connected to VP (standby
condition) during charge or discharge of the input and
SVRR capacitors.
The measured thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductor manufacturers because the
application boards and test methods are not standardized
yet. In addition, the thermal performance of packages for a
specific application may be different than presented here,
because the configuration of the application boards
(copper area) may be different. Philips Semiconductors
uses FR-4 type application boards with 1 oz. copper traces
with solder coating. The measurements have been carried
out with vertical placed boards.


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